Rakishith, Bairi Levi; Asirvatham, Lazarus Godson; Angeline, Appadurai Anitha; Raj, Jaya Antony Perinba Selvin; Bose, Jefferson Raja; Princess, P. Joyce Beryl; Gautam, Sneha; Mahian, Omid; Ribatski, Gherhardt 
; Wongwises, Somchai
Source: Applied Thermal Engineering. Unidade: EESC
Subjects: ELETRÔNICA DE POTÊNCIA, EVAPORAÇÃO, DISPOSITIVOS ELETRÔNICOS, ENGENHARIA MECÂNICA
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RAKISHITH, Bairi Levi et al. Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions. Applied Thermal Engineering, v. 236, p. 1-13, 2024Tradução . . Disponível em: http://dx.doi.org/10.1016/j.applthermaleng.2023.121474. Acesso em: 08 maio 2024.APA
Rakishith, B. L., Asirvatham, L. G., Angeline, A. A., Raj, J. A. P. S., Bose, J. R., Princess, P. J. B., et al. (2024). Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions. Applied Thermal Engineering, 236, 1-13. doi:10.1016/j.applthermaleng.2023.121474NLM
Rakishith BL, Asirvatham LG, Angeline AA, Raj JAPS, Bose JR, Princess PJB, Gautam S, Mahian O, Ribatski G, Wongwises S. Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions [Internet]. Applied Thermal Engineering. 2024 ; 236 1-13.[citado 2024 maio 08 ] Available from: http://dx.doi.org/10.1016/j.applthermaleng.2023.121474Vancouver
Rakishith BL, Asirvatham LG, Angeline AA, Raj JAPS, Bose JR, Princess PJB, Gautam S, Mahian O, Ribatski G, Wongwises S. Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions [Internet]. Applied Thermal Engineering. 2024 ; 236 1-13.[citado 2024 maio 08 ] Available from: http://dx.doi.org/10.1016/j.applthermaleng.2023.121474
